The electronic packaging handbook / edited by Glenn R. Blackwell.

By:

Blackwell, Glenn R. [ed.]

Contributor(s):

Blackwell, Glenn R

Material type: Text

TextSeries: Electronics handbook seriesPublication details: Boca Raton, FL : CRC Press : IEEE Press, c2000.Description: 1 v. (various pagings) : ill. ; 26 cmISBN:

0849385911
9780849385919

Subject(s):

DDC classification:

621.3810 21 BLA

LOC classification:

TK7870.15 .E4233 2000

Online resources:

Publisher description

Contents:

Fundamentals of the Design Process Surface Mount Technology Integrated Circuit Packages Direct Chip Attach Circuit Boards EMC and Printed Circuit Board Design Hybrid Assemblies Interconnects Design for Test Adhesive and Its Application Thermal Management Testing Inspection Package/Enclosure Electronics Package Reliability and Failure Analysis: A Micromechanics-Based Approach Product Safety and Third-Party Certification

Summary: The packaging of electronic systems and devices represents a serious challenge for designers managers. A major new entry in the Electrical Engineering series, The Electronic Packaging Handbook provides essential information on the design and packaging of electronic devices and systems. The book is valuable to engineers and technicians involved in any aspect of design, production, testing or packaging of electronic products. Topics covered include design automated new IC packaging technologies, materials, testing, and safety issues.

List(s) this item appears in: New Arrivals August 2022

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Holdings ( 1 )
Title notes ( 3 )
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Holdings
Item type	Current library	Collection	Call number	Status	Date due	Barcode
Reference	IIITDM Kurnool Reference	Reference	621.3810 BLA (Browse shelf(Opens below))	Reference		0004752

Includes bibliographical references and index.

Fundamentals of the Design Process
Surface Mount Technology
Integrated Circuit Packages
Direct Chip Attach
Circuit Boards
EMC and Printed Circuit Board Design
Hybrid Assemblies
Interconnects
Design for Test
Adhesive and Its Application
Thermal Management
Testing
Inspection
Package/Enclosure
Electronics Package Reliability and Failure Analysis: A Micromechanics-Based Approach Product Safety and Third-Party Certification

The packaging of electronic systems and devices represents a serious challenge for designers managers. A major new entry in the Electrical Engineering series, The Electronic Packaging Handbook provides essential information on the design and packaging of electronic devices and systems. The book is valuable to engineers and technicians involved in any aspect of design, production, testing or packaging of electronic products. Topics covered include design automated new IC packaging technologies, materials, testing, and safety issues.

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