Advanced electronic packaging Richard K. Ulrich, William D. Brown

By:

Richard K. Ulrich, William D. Brown

Material type: Text

9780471466093

DDC classification:

621.381 ULR

Contents:

CIRCUITS Electronic packaging MICROELECTRONICS MICROMODULES Microelectronic packaging

Summary: "As in the First Edition, each chapter in this new Second Edition is authored by one or more acknowledged experts and then carefully edited to ensure a consistent level of quality and approach throughout. There are new chapters on passive devices, RF and microwave packaging, electronic package assembly, and cost evaluation and assembly, while organic and ceramic substrates are now covered in separate chapters of the First Edition, which became an industry standard and a popular graduate-level textbook, have been retained. Instructor's Manual presenting detailed solutions to all the problems in the book is available upon request from the Wiley Makerting Department."--Publisher's website

List(s) this item appears in: New Arrivals (June 2024) | NEW ARRIVALS

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Holdings
Item type	Current library	Collection	Call number	Status	Date due	Barcode
Books	IIITDM Kurnool Reference	Reference	621.381 ULR (Browse shelf(Opens below))	Not For Loan		0005678

CIRCUITS
Electronic packaging
MICROELECTRONICS
MICROMODULES
Microelectronic packaging

"As in the First Edition, each chapter in this new Second Edition is authored by one or more acknowledged experts and then carefully edited to ensure a consistent level of quality and approach throughout. There are new chapters on passive devices, RF and microwave packaging, electronic package assembly, and cost evaluation and assembly, while organic and ceramic substrates are now covered in separate chapters of the First Edition, which became an industry standard and a popular graduate-level textbook, have been retained. Instructor's Manual presenting detailed solutions to all the problems in the book is available upon request from the Wiley Makerting Department."--Publisher's website

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