Fundamentals of microsystems packaging Tummala Rao R.

By:

Rao R. Tummala

Material type: Text

TextPublication details: New York McGraw-Hill's AccessEngineering 2001Description: 967PISBN:

9780071371698

DDC classification:

621.381 RAO

Contents:

Introduction to microsystems packaging Role of packaging in microelectronics Role of packaging in microsystems Fundamentals of electrical package design Fundamentals of design for reliability Fundamentals of thermal management Fundamentals of single chip packaging Fundamentals of multichip packaging Fundamentals of IC assembly Fundamentals of wafer-level packaging Fundamentals of passives: discrete, integrated, and embedded Fundamentals of optoelectronics Fundamentals of RF packaging Fundamentals of microelectromechanical systems Fundamentals of sealing and encapsulation Fundamentals of system-level PWB technologies Fundamentals of board assembly Fundamentals of packaging materials and processes Fundamentals of electrical testing Fundamentals of packaging manufacturing Fundamentals of microsystems design for environment Fundamentals of microsystems reliability

Summary: A rigorous and thorough introduction to electronic packaging technologies. Each chapter covers a single major packaging technology illustrated with schematics and diagrams. Aspects of electrical, mechanical, chemical, and materials packaging are identified in each chapte

List(s) this item appears in: NEW ARRIVALS

Tags from this library: No tags from this library for this title. Log in to add tags.

Average rating: 0.0 (0 votes)

Holdings ( 1 )
Title notes ( 2 )
Comments ( 0 )

Holdings
Item type	Current library	Collection	Call number	Status	Date due	Barcode
Reference	IIITDM Kurnool Reference	Reference	621.381 RAO (Browse shelf(Opens below))	Not For Loan		0006197

Browsing IIITDM Kurnool shelves, Shelving location: Reference, Collection: Reference Close shelf browser (Hides shelf browser)

Previous								Next
Previous	621.381 PLA V.2 Encyclopedia of Electronic Components	621.381 PLA V.3 Encyclopedia of Electronic Components	621.381 RAM Fundamentals of Microprocessors and Microcontrollers	621.381 RAO Fundamentals of microsystems packaging	621.381 RAV Tensorial analysis of networks (TAN) modelling for PBC signal integrity and EMC analysis	621.381 SAR Digital Design and Computer Architecture: RISC-V Edition	621.381 SAT Handbook of nanophysics. Nanoelectronics and nanophotonics	Next

Introduction to microsystems packaging
Role of packaging in microelectronics
Role of packaging in microsystems
Fundamentals of electrical package design
Fundamentals of design for reliability
Fundamentals of thermal management
Fundamentals of single chip packaging
Fundamentals of multichip packaging
Fundamentals of IC assembly
Fundamentals of wafer-level packaging
Fundamentals of passives: discrete, integrated, and embedded
Fundamentals of optoelectronics
Fundamentals of RF packaging
Fundamentals of microelectromechanical systems
Fundamentals of sealing and encapsulation
Fundamentals of system-level PWB technologies
Fundamentals of board assembly
Fundamentals of packaging materials and processes
Fundamentals of electrical testing
Fundamentals of packaging manufacturing
Fundamentals of microsystems design for environment
Fundamentals of microsystems reliability

A rigorous and thorough introduction to electronic packaging technologies. Each chapter covers a single major packaging technology illustrated with schematics and diagrams. Aspects of electrical, mechanical, chemical, and materials packaging are identified in each chapte

There are no comments on this title.

to post a comment.