Blackwell, Glenn R. [ed.] <br/><br/>
The electronic packaging handbook / 
edited by Glenn R. Blackwell. 
 - Boca Raton, FL :  CRC Press :  IEEE Press,  c2000. 
 - 1 v. (various pagings) :  ill. ;  26 cm. 
 - Electronics handbook series .
<br/><br/>Includes bibliographical references and index. 
<br/><br/> Fundamentals of the Design Process<br/>  Surface Mount Technology<br/>  Integrated Circuit Packages<br/>  Direct Chip Attach<br/>  Circuit Boards<br/>  EMC and Printed Circuit Board Design<br/>  Hybrid Assemblies<br/>  Interconnects<br/>  Design for Test<br/>  Adhesive and Its Application<br/>  Thermal Management<br/>  Testing<br/>  Inspection<br/>  Package/Enclosure<br/>  Electronics Package Reliability and Failure  Analysis: A Micromechanics-Based Approach  Product Safety and Third-Party Certification<br/> 
<br/><br/> The packaging of electronic systems and devices represents a serious challenge for designers managers. A major new entry in the Electrical Engineering series, The Electronic Packaging Handbook provides essential information on the design and packaging of electronic devices and systems. The book is valuable to engineers and technicians involved in any aspect of design, production, testing or packaging of electronic products. Topics covered include design automated new IC packaging technologies, materials, testing, and safety issues. 
<br/><br/><label>ISBN: </label>0849385911  9780849385919 
<br/><br/><label>LCCN: </label>99041244  
<br/><br/><label>Subjects--Topical Terms: </label><br/>Electronic packaging--Handbooks, manuals, etc.
<br/><br/><label>LC Class. No.: </label>TK7870.15  / .E4233 2000 
<br/><br/><label>Dewey Class. No.: </label>621.3810  / BLA