TY  - BOOK
AU  - Paunovic, Milan; 
AU  - Schlesinger, Mordechay;
AU  -  Electrochemical Society
TI  - Fundamentals of electrochemical deposition
SN  - 9780471712213
U1  - 671.732 
PY  - 2006///
CY  -  Hoboken, N.J., 
PB  - Wiley
KW  -  Electronic books
KW  - Electroplating
KW  - Galvanoplastie
KW  - TECHNOLOGY & ENGINEERING Technical & Manufacturing Industries & Trades electroplating
N1  - 
Water and ionic solutions
Metals and metal surfaces
Metal-solution interphase
Equilibrium electrode potential
Kinetics and mechanism of electrodeposition
Nucleation and growth models
Electroless deposition
Displacement deposition
Effect of additives
Electrodeposition of alloys
Metal deposit and current distribution
Characterization of metallic surfaces and thin films
In situ characterization of deposition
Mathematical modeling in electrochemistry
Structure and properties of deposits
Electrodeposited multilayers
Interdiffusion in thin films
Applications in semiconductor technology
Applications in the fields of magnetism and microelectronics
Frontiers in applications : the field of medicine
N2  - Electrochemical deposition is used in traditional areas like computer hardware, medical diagnostics, and aerospace and is important to fields like nanotechnology and microelectronics. Fundamentals of Electrochemical Deposition, Second Edition is a comprehensive introduction to one of today's most exciting and rapidly evolving fields of practical knowledge
ER  -