Fundamentals of microsystems packaging
Tummala Rao R.
- New York McGraw-Hill's AccessEngineering 2001
- 967P
Introduction to microsystems packaging Role of packaging in microelectronics Role of packaging in microsystems Fundamentals of electrical package design Fundamentals of design for reliability Fundamentals of thermal management Fundamentals of single chip packaging Fundamentals of multichip packaging Fundamentals of IC assembly Fundamentals of wafer-level packaging Fundamentals of passives: discrete, integrated, and embedded Fundamentals of optoelectronics Fundamentals of RF packaging Fundamentals of microelectromechanical systems Fundamentals of sealing and encapsulation Fundamentals of system-level PWB technologies Fundamentals of board assembly Fundamentals of packaging materials and processes Fundamentals of electrical testing Fundamentals of packaging manufacturing Fundamentals of microsystems design for environment Fundamentals of microsystems reliability
A rigorous and thorough introduction to electronic packaging technologies. Each chapter covers a single major packaging technology illustrated with schematics and diagrams. Aspects of electrical, mechanical, chemical, and materials packaging are identified in each chapte