Image from Amazon.com
PCB design guide to via and trace currents and temperatures Douglas Brooks, Johannes Adam
Material type:
TextPublication details: Artech House, Norwood, 2021Description: xx, 271 pages : illustrations (some color) ; 24 cmISBN: - 9781630818609
- 621.3815 BRO
Contents:
Introduction and Historical Background Materials Used in PCB; Resistivity and Resistance Trace Heating and Cooling IPC Curves; Thermal Simulation Model + Thermal Simulations Via Temperatures Current Densities in Vias Thinking Outside the Box Fusing Currents Background Fusing Currents Analyses Do Traces Heat Uniformly Relevance of Current Density AC Currents Industrial CT Scanning
| Item type | Current library | Collection | Call number | Status | Date due | Barcode |
|---|---|---|---|---|---|---|
Books
|
IIITDM Kurnool General Stacks | Non-fiction | 621.3815 BRO (Browse shelf(Opens below)) | Available | 0004745 |
Introduction and Historical Background Materials Used in PCB; Resistivity and Resistance Trace Heating and Cooling IPC Curves; Thermal Simulation Model + Thermal Simulations Via Temperatures Current Densities in Vias Thinking Outside the Box Fusing Currents Background Fusing Currents Analyses Do Traces Heat Uniformly Relevance of Current Density AC Currents Industrial CT Scanning
There are no comments on this title.