000			01837nam a22002297a 4500
005			20240215111127.0
008			240215b |||||||| |||| 00| 0 eng d
020			_a9783527335015 (PB)
041			_heng
082			_a620.5 _bTAB
100			_aTabata,Osamu
245			_aReliability of MEMS _bTesting of Materials and Devices
260			_bWiley _c2013
300			_axx,303 p
440			_a(Advanced Micro & Nanosystems)
505			_aEvaluation of Mechanical Properties of MEMS Materials and Their Standardization Elastoplastic Indentation Contact Mechanics of Homogeneous Materials and Coating-Substrate Systems Thin film Characterization Using the Bulge Test Uniaxial Tensile Test for MEMS Materials On-chip Testing of MEMS Reliability of a Capacitive Pressure Sensor Inertial Sensors High-Accuracy, High-Reliability MEMS Accelerometer Reliability of MEMS Variable Optical Attenuator Reliability of MEMS Variable Optical Attenuator (pages 239-266) Eco Scan MEMS Resonant Mirror
520			_aThis first book to cover exclusively and in detail the principles, tools and methods for determining the reliability of microelectromechanical materials, components and devices covers both component materials as well as entire MEMS devices. Divided into two major parts, following a general introductory chapter to reliability issues, the first part looks at the mechanical properties of the materials used in MEMS, explaining in detail the necessary measuring technologies -- nanoindenters, bulge methods, bending tests, tensile tests, and others. Part Two treats the actual devices, organized by important device categories such as pressure sensors, inertial sensors, RF MEMS, and optical MEMS.
650			_a Physics Atomic & Molecular
650			_aMEMS Materials
700			_aTsuchiya,Toshiyuki
942			_2ddc _cBK
999			_c2055 _d2055