000			01726nam a22002177a 4500
005			20240219122115.0
008			240219b |||||||| |||| 00| 0 eng d
020			_a9781475774580 (PB)
041			_g621.381 _heng
082			_bSEN
100			_aSenturia,Stephen D.
245			_aMicrosystem design
260			_aBoston _bKluwer Academic Publishers, _c2001
300			_a xxvi, 689 p
505			_aForeword. Preface. Acknowledgments. Part I: Getting Started. 1. Introduction. 2. An Approach to MEMS Design. 3. Microfabrication. 4. Process Integration. Part II: Modeling Strategies. 5. Lumped Modeling. 6. Energy-Conserving Transducers. 7. Dynamics. Part III: Domain-Specific Details. 8. Elasticity. 9. Structures. 10. Energy Methods. 11. Dissipation and the Thermal Energy Domain. 12. Lumped Modeling of Dissipative Processes. 13. Fluids. Part IV: Circuit and System Issues. 14. Electronics. 15. Feedback Systems. 16. Noise. Part V: Case Studies. 17. Packaging. 18. A Piezoresistive Pressure Sensor. 19. A Capacitive Accelerometer. 20. Electrostatic Projection Displays. 21. A Piezoelectric Rate Gyroscope. 22. DNA Amplification. 23. A Microbridge Gas Sensor. Appendices: A. Glossary of Notation. B. Electromagnetic Fields. C. Elastic Constants in Cubic Material. References. Index.
520			_aIt is a real pleasure to write the Foreword for this book, both because I have known and respected its author for many years and because I expect this book’s publication will mark an important milestone in the continuing worldwide development of microsystems.
650			_a Microelectromechanical systems Design and construction
650			_aELECTROMECHANICAL DEVICES
650			_aMICRO MECHANICS
942			_2ddc _cBK
999			_c2082 _d2082