000			09463nam a22001817a 4500
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020			_a 9789390385515
082			_a621.381 _bTUM
100			_aTummala, Rao R.
245			_aFundamentals Of Device & Systems Packaging _cRao Tummala
250			_a2
260			_aChennai: _bMcGraw Hill Education India, _c2020.
300			_axx, 828p
505			_t1 Introduction to Device and Systems Packaging Technologies 1.2 Anatomy of an Electronic Packaged System from a Packaging Point of View 1.3 Devices and Moore’s Law 1.4 Electronic Technology Waves: Microelectronics, RF/Wireless, Photonics, MEMS, and Quantum Devices 1.5 Packaging and Moore’s Law for Packaging 1.6 Electronic Systems Technologies Trends 1.7 Future Outlook 1.8 How the Book Is Organized 1.9 Homework Problems 1.10 Suggested Reading Part 1 Fundamentals of Packaging 2 Fundamentals of Electrical Design for Signals, Power, and Electromagnetic Interference 2.1 What Is Electrical Package Design and Why? 2.2 Electrical Anatomy of a Package 2.3 Signal Distribution 2.4 Power Distribution 2.5 Electromagnetic Interference 2.6 Summary and Future Trends 2.7 Homework Problems 2.8 Suggested Reading 3 Fundamentals of Thermal Technologies 3.1 What Is Thermal Management and Why? 3.2 Anatomy of a Thermal Package System 3.3 Chip Level Thermal Technologies 3.4 Module Level Thermal Technologies 3.5 System Level Thermal Technologies 3.6 Power and Cooling Technologies for Electric Vehicles 3.7 Summary and Future Trends 3.8 Homework Problems 3.9 Suggested Reading 4 Fundamentals of Thermo-Mechanical Reliability 4.1 What Is Thermo-Mechanical Reliability? 4.2 Anatomy of a Package with Failures and Failure Mechanisms 4.3 Types of Thermo-Mechanical-Induced Failures and Design Guidelines for Reliability 4.4 Summary and Future Trends 4.5 Homework Problems 4.6 Suggested Reading 5 Fundamentals of Package Materials at Microscale and Nanoscale 5.1 What Is the Role of Materials in Packaging? 5.2 Anatomy of a Package with a Variety of Materials 5.3 Package Materials, Processes, and Properties 5.4 Summary and Future Trends 5.5 Homework Problems 5.6 Suggested Reading 6 Fundamentals of Ceramic, Organic, Glass, and Silicon Package Substrates 6.1 What Is a Package Substrate and Why? 6.2 Anatomy of Three Package Substrates: Ceramics, Organic Laminates, and Silicon 6.3 Package Substrate Technologies 6.3.1 Historical Trends 6.4 Thick-Film Substrates 6.5 Thin-Film Substrates 6.6 Ultra-Thin-Film Substrates with Semiconductor Packaging Processes 6.7 Summary and Future Trends 6.8 Homework Problems 6.9 Suggested Reading 7 Fundamentals of Passive Components and Integration with Active Devices 7.1 What Are Passive Components and Why? 7.2 Anatomy of Passive Components 7.3 Passive Component Technologies 7.4 Functional Modules with Passives and Actives 7.5 Summary and Future Trends 7.6 Homework Problems 7.7 Suggested Reading 8 Fundamentals of Chip-to-Package Interconnections and Assembly 8.1 What Are Chip-to-Package Interconnections and Assembly and Why? 8.2 Anatomy of an Interconnection and Assembly 8.4 Interconnections and Assembly Technologies 8.5 Future Trends in Interconnection and Assembly Technologies 8.5.1 Extension of SLID 8.6 Homework Problems 8.7 Suggested Reading 9 Fundamentals of Embedded and Fan-Out Packaging 9.2 Anatomy of a Fan-Out Wafer-Level Package (FO-WLP) 9.3 Fan-Out Wafer-Level Package Technologies 9.4 Panel-Level Package (PLP) 9.5 Summary and Future Trends 9.6 Homework Problems 9.7 Suggested Reading 10 Fundamentals of 3D Packaging with and without TSV 10.2 Anatomy of a 3D Package with TSV 10.3 3D ICs with TSV Technologies 10.4 Summary and Future Trends 10.5 Homework Problems 10.6 Suggested Reading 10.7 Acknowledgment 11 Fundamentals of RF and Millimeter-Wave Packaging 11.2 Anatomy of an RF System 11.3 RF Technologies and Applications 11.4 What Is a Millimeter-Wave System? 11.5 Anatomy of a Millimeter-Wave Package 11.6 Millimeter-Wave Technologies and Applications 11.7 Summary and Future Trends 11.8 Homework Problems 11.9 Suggested Reading 12 Fundamentals of Optoelectronics Packaging 12.1 What Is Optoelectronics? 12.2 Anatomy of an Optoelectronics System 12.3 Optoelectronic Technologies 12.4 Optoelectronic Systems, Applications, and Markets 12.5 Summary and Future Trends 12.6 Homework Problems 12.7 Suggested Reading 13 Fundamentals of MEMS and Sensor Packaging 13.1 What Are MEMS?13.1.1 Historical Evolution 13.2 Anatomy of a MEMS Package 13.3 MEMS and Sensor Device Fabrication Technologies 13.4 MEMS Packaging Technologies 13.5 Application of MEMS and Sensors 13.6 Summary and Future Trends 13.7 Homework Problems 13.8 Suggested Reading 14 Fundamentals of Package Encapsulation, Molding, and Sealing 14.1 What Is Sealing and Encapsulation and Why? 14.2 Anatomy of an Encapsulated and a Sealed Package 14.3 Properties of Encapsulants 14.4 Encapsulation Materials 14.5 Encapsulation Processes 14.6 Hermetic Sealing 14.7 Summary and Future Trends 14.8 Homework Problems 14.9 Suggested Reading 15 Fundamentals of Printed Wiring Boards 15.1 What Is a Printed Wiring Board? 15.2 Anatomy of a Printed Wiring Board 15.3 Printed Wiring Board Technologies 15.4 Summary and Future Trends 15.5 Homework Problems 15.6 Suggested Reading 16 Fundamentals of Board Assembly 16.1 What Is a Printed Circuit Board Assembly (PCBA) and Why? 16.2 Anatomy of Printed Circuit Board Assembly 16.3 PCBA Technologies 16.4 Types of Printed CircuitBoard Assembly 16.5 Types of Assembly Soldering Processes 16.6 Summary and Future Trends 16.7 Homework Problems 16.8 Suggested Reading 16.9 Acknowledgment Part 2 Applications of Packaging Technologies 17 Applications of Packaging Technologies in Future Car Electronics 17.1 What Are Future Car Electronics and Why? 17.2 Anatomy of a Future Car 17.3 Future Car Electronic Technologies 17.4 Summary and Future Trends 17.5 Homework Problems 17.6 Suggested Reading 18 Applications of Packaging Technologies in Bioelectronics 18.1 What Are Bioelectronics? 18.2 Packaging Technologies for Bioelectronic Systems 18.3 Examples of Bioelectronic Implants 18.4 Summary and Future Trends 18.5 Homework Problems 18.6 Suggested Reading 19 Applications of Packaging Technologies in Communication Systems 19.1 What Are Communication Systems and Why? 19.2 Anatomy of Two Communication Systems: Wired and Wireless 19.3 Communication System Technologies 19.4 Summary and Future Trends 19.5 Homework Problems 19.6 Suggested Reading 20 Applications of Packaging Technologies in Computing Systems 20.1 What Is Computer Packaging? 20.2 The Anatomy of a Computer Package 20.3 Computer Packaging Technologies 20.4 Thermal Technologies 20.5 Summary and Future Trends 20.6 Homework Problems 20.7 Suggested Reading 20.8 Acknowledgments 21 Applications of Packaging Technologies in Flexible Electronics 21.1 What Are Flexible Electronics and Why? 21.2 Anatomy of a Flexible Electronic System 21.4 Summary and Future Trends 21.5 Homework Problems 21.6 Suggested Reading 22 Applications of Packaging Technologies in Smartphones 22.1 What Are Smartphones? 22.2 Anatomy of a Smartphone 22.3 Smartphone Packaging Technologies 22.4 Systems Packaging in Smartphones 22.5 Summary and Future Trends 22.6 Homework Problems 22.7 Suggested Reading
520			_aThis thoroughly revised book offers the latest, comprehensive fundamentals in device and systems packaging technologies and applications. Readers will get in-depth explanations of the 15 core packaging technologies that make up any electronic system, including electrical design for power, signal, and EMI; thermal design by conduction, convection, and radiation heat transfer; thermo-mechanical failures and reliability; advanced packaging materials at micro and nanoscales; ceramic, organic, glass, and silicon substrates. This resource also discusses passive components such as capacitors, inductors, and resistors and their proximity integration with actives; chip-to-package interconnections and assembly; wafer and panel embedding technologies; 3D packaging with and without TS; RF and millimeter-wave packaging; role of optoelectronics; mems and sensor packaging ;encapsulation, molding and sealing; and printed wiring board and its assembly to form end-product systems. Fundamentals of Device and Systems Packaging: Technologies and Applications, Second Edition introduces the concept of Moore’s Law for packaging, as Moore’s Law for ICs is coming to an end due to physical, material, electrical, and financial limitations. Moore’s Law for Packaging (MLP) can be viewed as interconnecting and integrating many smaller chips with high aggregate transistor density, at higher performance and lower cost than Moore’s Law for ICs. This book lays the groundwork for Moore’s Law for Packaging by showing how I/Os have evolved from one package family node to the next, starting with <16 I/Os in the 1960s with leadframe-plastic packages to the current silicon interposers with about 200,000 I/Os. It proposes a variety of ways to extend Moore’s Law, such as extending Si interposers and beyond using glass panel embedding.
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